RLS Services – Wafer Probing and Chip-on-Board Packaging Solutions
From wafer sorting to COB assembly, we enable fast, reliable and traceable chip manufacturing in Europe.
RLS is a leading European technology company with decades of experience and in-house R&D and manufacturing of rotary and linear magnetic encoders. Our new Semiconductor Services division brings this expertise to the world of wafer testing, dicing, die bonding, wire bonding and encapsulation — all in a certified ISO 8 clean room environment in Komenda, Slovenia.
We help fabless semiconductor companies, startups, and specialised industries to shorten time to market and reduce CAPEX by offering flexible, high-quality pilot production and low-volume processing services.
Our capabilities
Wafer sort
Wafer dicing
Die attach
Wire bonding
Encapsulation
Why choose RLS?
European quality, faster delivery
Avoid long shipping times and customs delays — all packaging is performed locally in our 200 m² ISO 8 clean room, ensuring fast, reliable turnaround across the EU.
End-to-end in-house packaging
From wafer to reel, we handle the entire process — including dicing, bonding, encapsulation, and tape & reel — for consistent quality and full traceability.
Custom engineering and tooling expertise
We support your project from design-for-test to substrate selection, with in-house fixture development and advanced chip-on-board and optical integration capabilities.
Scalable pilot production
Perfect for prototyping, MPW runs, or low-volume production — ideal for medical, industrial, and automotive applications.
Responsive local support
Work directly with our engineering team — no time zone delays or language barriers.
