Photodiode Array PA2033

Overview

Introduction

The photosensor consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy glue. The Array can be used in photovoltaic or photoconductive mode.

Features

  • High responsitivity
  • Low capacitance
  • High reliability
  • Peak wavelength at 830 nm

Documentation

Doc. no. Issue Description Type Size
PA2033 / PA2033 Data sheet PDF File 55 KB

Sample request

RLS offers free component samples to qualified OEM customers and professional design engineers. Please note that RLS will qualify each request and limit the number of units provided free of charge to each customer.

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PA2033